Wafer and Die Alignment

Accurately align wafer and dies to ensure reliable performance

Whether during the photolithographic process, wafer probe and test, or wafer mounting and dicing, poor vision alignment can cause thousands of assists and damaged wafers over the lifespan of a machine. Poorly performing vision systems cost semiconductor equipment companies market share and add significantly to their support costs.

 

SolutionBank's technology provides robust, accurate, and fast wafer and die pattern location for wafer inspection, probing, mounting, dicing, and testing equipment to help avoid these problems. It aligns wafers and dies with high accuracy and high repeatability, ensuring reliable equipment performance throughout the semiconductor manufacturing process. With SolutionBank, OEMs can optimize their equipment’s overall performance, improving quality and yield.

 

For more details, business please contact:

SOLUTIONBANK CORPORATION

Headquarter: 9 Phan Ke Binh Street, Da Kao Ward, District 1, Ho Chi Minh City, Vietnam

Hotline: +8496 113 0541

Email: sales@solutionbank.asia